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.The tests must beperformed while power is applied to the component.Formore information, see the section Using a Multimeter. 9.The power supply.For more information, see the section Isolating Power Supply Problems. 10.Reinstall the removed components one at a time until theproblem reappears.The last component returned to thesystem is at least partially responsible for the problem.How-ever, other removed components must be reinstalled toconfirm that only one was bad.For more information, seethe section Hardware Troubleshooting. 11.That at least the last component reinstalled is defective.Formore information, see the section FRU Troubleshooting. 12.If the system boots up from the minimal condition of theClean Boot or Startup disk, restart the system and press theF8 function key while the Starting MS-DOS message is onthe screen to single-step through the CONFIG.SYS andAUTOEXEC.BAT files.The single-step method can be usedto isolate the problem command.For more information, seethe section DOS Startup Problems. 13.Fuses, speakers, and the continuity of connecting cables.Formore information, see the section Using a Multimeter. 14.Near zero ohms.For more information, see the section Using a Multimeter. 15.DRWATSON.LOG.For more information, see the section Using Dr.Watson. 16.Test the hardware with software that has been known to op-erate correctly in the past.For more information, see thesection Determining Hardware/Software/ConfigurationProblems. 17.DETLOG.TXT.For more information, see the section DETCRASH.LOG. A+ Certification Training Guide37218.Zero ohms.For more information, see the section Using aMultimeter. 19.5 VDC.For more information, see the section Using a Mul-timeter. 20.The operator.For more information, see the section InitialTroubleshooting Steps. 21.The FDISK, FORMAT, SYS, EDIT, CHKDSK, MSD,CONFIG.SYS, and AUTOEXEC.BAT files should be includedin the clean boot disk.For more information, see the section Self-Booting DOS Disk. 22.The BOOTLOG.TXT file contains the sequence of eventsconducted during the Startup of the system.For more infor-mation, see the section BOOTLOG.TXT. 23.The highest range possible.For more information, see thesection Using a Multimeter. 24.The system checked for the Floppy Controller at IO=3f2-3f5,IO=372-375, and detected it at IO=3f2-3f5.It allocates IRQ=6and DMA=2 to the floppy drive.For more information, seethe section DETLOG.TXT. 25.Detected: *PNP0C04\0000 = [6] Numeric data processor;IO=f0-ff; IRQ=13.For more information, see the section DETLOG.TXT. 26.The system-critical virtual machine driver has not been suc-cessfully initialized.For more information, see the section BOOTLOG.TXT. Chapter 6 System Boards373C h a p t e r66System BoardsAfter completing this chapter and its related lab procedures, youshould be able to meet the following objectives:Objectives.Define AT-compatible interrupt and DMA addresses.List advantages of chip-set based circuit design.Identify various microprocessors from their package type.Discuss the major attributes of popular microprocessors.Define real, protected, and virtual addressing modes.Define MMX technology.Describe the internal structure of a typical integrated pe-ripheral controller (IPC) IC.Describe operation of the real-time clock (RTC) circuitry.Identify the internal register structure of the IPC s timer/counter subsystem.Describe the use of the timer/counters output signals in thetypical PC-compatible system.List the sequence of events that occur during a typical inter-rupt operation.Identify conditions that will cause an NMI interrupt tooccur.Describe the events of a typical DMA operation, and differ-entiate between the modes of DMA transfers.continues A+ Certification Training Guide374.Differentiate between static and dynamic RAM memory de-vices, and state the conditions that dictate which of the twowill be used in a given application.Differentiate between EVEN and ODD parity schemes.Describe how the microprocessor works with a first or sec-ond level cache memory
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